ENABLING PERFORMINIATURIZATION*

Silicon Interposer

Component Array

Silicon Capacitor

High Q inductors

High density capacitors

Resistors

ULTRA MINIATURIZED silicon passive components
with
HIGH PERFORMANCE, HIGH STABILITY
and HIGH RELIABILITY FEATURES.

  • From one to ten components in one silicon die.
  • Capacitance integration, up to 500 nF/mm².
  • Ultra low profile passives down to 30 µm.
  • Excellent electrical performances: up to 60 GHz bandwidth,
    low ESR/ESL.
  • Extreme operating conditions up to 250°C.
  • High reliability: more than 100 times better
    than alternative technologies.

Passive Integration Connecting Substrate

*PerforMiniaturization: process of miniaturizing and optimizing performances of electronic boards.

Innovative
Technology

Statement

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